| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment apparatus capable of surely preventing overbaking caused by a hot plate and obtaining high throughput. SOLUTION: The heat treatment apparatus 16 is provided with a post-exposure bake plate PEB, a cooling plate CP3, and a local transfer robot LHU. A holding plate 51 of the local transfer robot LHU can move closely to the substantially whole surface of the bottom of a substrate W to hold the substrate W. Also, the holding plate 51 is configured so that it can reciprocate between the bake plate PEB and the cooling plate CP3 and can also move in the upward and downward directions. The substrate heated with the bake plate PEB is somewhat cooled by being received by the holding plate 51, and is moved to the cooling plate CP3 and fits a recessed portion 49, thereby cooling the substrate W and performing accurate temperature control. COPYRIGHT: (C)2005,JPO&NCIPI |
