Methods and apparatus for efficiently analyzing defects in-line on a wafer by wafer basis are provided. In general terms, embodiments of the present invention provide a simple interface (158, 500) for setting up the entire inspection and defect analysis process in a single set up procedure. In one embodiment, an apparatus for analyzing defects on specimens (100) is disclosed. The apparatus includes an inspection station for inspecting a specimen for potential defects (102) and a review station for analyzing a sample of the potential defects to determine a classification of such potential defects (104). The apparatus further includes a computer system (152) having an application interface (158, 500) operable to allow a user to set up the inspection station and the review station during a same setup phase so as to allow the inspection station and the review station to then operate automatically to provide defect information for one or more specimens based on the user set up. Techniques for using such apparatus are also disclosed.
申请公布号
WO2004097903(A2)
申请公布日期
2004.11.11
申请号
WO2004US13642
申请日期
2004.04.29
申请人
KLA-TENCOR TECHNOLOGIES CORPORATION;TOTH, GABOR, D.;BAKKER, DAVID, R.