发明名称 METHOD FOR MANUFACTURING FILM CARRIER TAPE FOR PACKAGING ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a film carrier tape for packaging an electronic part which reduces the influence of a laser beam to a conductive metal layer provided on the rear surface of an insulating film when a through hole is formed in the insulating film by using the laser beam. SOLUTION: The method for manufacturing the film carrier tape for packaging the electronic part includes a step of forming the through hole by irradiating the insulating film of a base material in which a conductive metal film is laminated on at least one surface of the insulating film. The method further includes the steps of coating the surface of the conductive metal film disposed at least at the part irradiated with the laser beam from the rear surface with a resin to form a resin coating layer, then irradiating the insulating film side with the laser beam to perforate a through hole in the insulating film. According to this, when the through hole is formed in the insulating film with the laser beam, the conductive metal layer disposed on the rear surface is hardly thermally deformed by this heat. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004311654(A) 申请公布日期 2004.11.04
申请号 JP20030102092 申请日期 2003.04.04
申请人 MITSUI MINING & SMELTING CO LTD 发明人 MATSUMURA YASUNORI;TANAKA YASUMASA
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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