| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To safely cool the substrate sucked and held on a cooling plate. <P>SOLUTION: The substrate 30 is placed on minute projections 45 of the cooling plate 13. A vacuum suction hole 40a of the cooling plate 13 is operated by a vacuum control unit 42 to suck only the center 31 of the substrate 30, then vacuum suction holes 40b, 40c, 40d and 40e are successively operated to successively suck the centers 32, 33, 34 and 35 of the substrate 30, and finally a vacuum suction hole 40f is operated to suck a periphery 36 of the substrate 30. In this way, the air between the cooling plate 13 and the substrate 30 is discharged to the outside. During this period, the substrate 30 can be safely cooled by the cooling plate 13. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
