发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent consumption of a wiring resource which is ascribed to connecting portions between power source wiring and other wiring, and to prevent reduction of a region for arranging a substrate contact. SOLUTION: First VDD wiring 1 is provided at a first wiring layer, and first VSS wiring 2 is provided at a second wiring layer which is located above the first wiring layer so as to vertically face the first VDD wiring 1. Second VSS wiring 3 is provided at the first wiring layer so as to be adjacent to the first VDD wiring 1, and second VDD wiring 4 is provided at the second wiring layer so as to vertically face the second VSS wiring 3. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004311708(A) 申请公布日期 2004.11.04
申请号 JP20030103050 申请日期 2003.04.07
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OZAWA DAISUKE
分类号 H01L21/3205;H01L21/82;H01L21/822;H01L23/52;H01L27/04;(IPC1-7):H01L21/822;H01L21/320 主分类号 H01L21/3205
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