FILM CARRIER AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

A semiconductor device capable of dealing with the reduction of the pitch of wires on a semiconductor element, an increase in the chip mounting density and the reduction of the thickness of a semiconductor device, and having excellent adherence between an insulating resin used for sealing a semiconductor element and a film carrier, and a high reliability. Referring to Fig. 1, conductor circuits 5 are buried so as not to be exposed to both surfaces 6a, 6b of an insulating layer 6, and a pair of conductive passages 7, 8 are formed so as to extend from both surfaces 5a, 5b of the conductor circuits 5 in a staggered manner with respect to the direction of the surfaces of the conductor circuits 5. The conductive passages 7, 8 are connected to bumps 9, 10, that is, the conductor circuits 5 and bumps 9, 10 are electrically connected through the conductive passages 7, 8. The bumps 9 formed on one end of one conductive passage in a film carrier 2 are connected electrically to electrodes 12 of a semiconductor element 3, and the film carrier 2 supports the semiconductor element 3. An insulating resin layer 4 is formed so as to cover the semiconductor element 3 and contact one surface 6a of the insulating layer 6.