| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide semiconductor mounting equipment wherein a position which is set for arranging an IC chip on a substrate is aligned with the terminal electrodes of the IC chip with high precision and mounting is enabled when the IC chip is mounted by a face up method. <P>SOLUTION: Infrared is projected from an opposite side surface of an element formation surface of the IC chip 11 by using an infrared transparent recognizing optical system 15. The infrared reflected on the lower surface of an adsorbing nozzle 9a is received by an image pickup device 65, and image pickup is performed. The IC pattern mark of the element formation surface of the IC chip 11 is recognized, and a substrate mark 25a formed on the surface of a substrate 25 is imaged with a substrate recognizing optical system 13 and recognized. These recognition results are calculated, mutual position of the adsorbing nozzle 9a wherein the IC chip 11 is adsorbed and a stage 27 on which the substrate 25 is set is corrected based on the result of calculation. The IC chip 11 is arranged on a prescribed position of the substrate 25 and mounted. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
