WAFER HOLDING BODY FOR SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR MANUFACTURING DEVICE MOUNTED WITH IT

摘要

PROBLEM TO BE SOLVED: To provide a wafer holding body for semiconductor manufacturing device having a wafer mounting surface improved in soaking property, and to provide a semiconductor manufacturing device mounted with the holding body. SOLUTION: In the wafer holding body having the wafer mounting surface, shafts which support the holding body are joined to the holding body. When the heat capacities of electrodes which feed electricity to an electric circuit formed on the surface of the wafer holding body except the wafer mounting surface or in the holding body in the shafts are adjusted to≤10% of the heat capacities of the portions of the wafer holding body corresponding to the insides of the outer peripheral sections of the shafts, the temperature distribution on the wafer holding surface can be controlled within the range of≤±1.0%. It is preferable that the electric circuit formed on the wafer holding body is at least a resistance heat generating body. COPYRIGHT: (C)2004,JPO&NCIPI