发明名称 COVER TAPE AND PACKAGING BODY
摘要 PROBLEM TO BE SOLVED: To provide a cover tape and packaging body comprising a seal layer which is low in contamination migration to encased objects such as electronic parts and that keeps a stable, sufficient bonding capacity and an anti-static function free from change with time under an environment of high temperature and high humidity, and that is excellent in resistance to blocking and in transparency. SOLUTION: The cover tape is composed of a base sheet and a seal layer provided on the base sheet. The seal layer includes a thermoplastic resin and aπ-electron conjugate type conductive polymer solid-solved in the resin, and the concentration of ionic residual substance of the seal layer is 10 ppm or lower. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004262548(A) 申请公布日期 2004.09.24
申请号 JP20030355419 申请日期 2003.10.15
申请人 SHIN ETSU POLYMER CO LTD 发明人 TANIGUCHI ATSUSHI;KAWAGUCHI TOSHIYUKI
分类号 B65D73/02;B32B27/18;B65D65/40;B65D85/86;(IPC1-7):B65D65/40 主分类号 B65D73/02
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