| 发明名称 |
REDUCED CONTAMINATION OF TOOLS IN SEMICONDUCTOR PROCESSING |
| 摘要 |
An improved method of reducing contamination in processing of ICs is disclosed. The method includes forming a contamination protection layer on at least the back surface of the substrate. The contamination protection layer comprises a low diffusion factor and can be cleaned efficiently. In one embodiment, the contamination protection layer comprises HCD silicon nitride.
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| 申请公布号 |
US2004171252(A1) |
申请公布日期 |
2004.09.02 |
| 申请号 |
US20030248898 |
申请日期 |
2003.02.28 |
| 申请人 |
ZHUANG HAOREN;NATORI KATSUAKI;BEITEL GERHARD;MOON BUM-KI;YABUKI MOTO;TSUNASHIMA YOSHITAKA;HORNIK KARL |
发明人 |
ZHUANG HAOREN;NATORI KATSUAKI;BEITEL GERHARD;MOON BUM-KI;YABUKI MOTO;TSUNASHIMA YOSHITAKA;HORNIK KARL |
| 分类号 |
H01L21/302;(IPC1-7):H01L21/302;H01L21/461 |
主分类号 |
H01L21/302 |
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