MANUFACTURING APPARATUS FOR SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a semiconductor device which is capable of forming a clean conductive film restraining a volatile metal compound originating from the film from adhering to the surface of the conductive film, when a treated substrate with a film containing metal elements becoming the components of the volatile metal compound is subjected to thermal treatment. SOLUTION: The apparatus 1 for manufacturing a semiconductor device is equipped with a chamber 2, a heating device 3, and an adsorbent 4. The treated substrate 5 with films 34 and 35 containing metal elements serving as the components of the volatile metal compound is held inside the chamber 2. The treated substrate 5 held inside the chamber 2 is heated by the heating device 3. The adsorbent 4 is provided inside the chamber 2 in a freely detachable manner, and the volatile metal compound generated from the films 34 and 35 by heating the treated substrate 5 is adsorbed by the adsorbent. COPYRIGHT: (C)2004,JPO&NCIPI