发明名称 |
Resistive vias in a substrate |
摘要 |
A rigid substrate board (105) having at least one layer with first (106) and second (107) opposing surfaces. At least one bore is formed in the layer and extending from the first surface (106) to the second surface (107). A resistive material is disposed within the bore and fills the bore to form a resistor (140). Further, a first conductor (115) is disposed on the first surface (106) to form an electrical connection with a first end of the resistor (140), and a second conductor (120) is disposed on the second surface to form an electrical connection with a second end of the resistor. A plurality of resistors (140) can be formed in the substrate layer (105) and interconnected to define a resistive network. |
申请公布号 |
US2004163234(A1) |
申请公布日期 |
2004.08.26 |
申请号 |
US20030373153 |
申请日期 |
2003.02.24 |
申请人 |
PROVO TERRY;NEWTON C. MICHAEL |
发明人 |
PROVO TERRY;NEWTON C. MICHAEL |
分类号 |
H01C1/16;H01C13/02;H01L23/498;H05K1/16;H05K3/40;H05K3/46;(IPC1-7):H01C1/012;H01C17/28 |
主分类号 |
H01C1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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