FILM FORMATION METHOD

摘要

PROBLEM TO BE SOLVED: To provide a specific film formation process which is hardly affected by external environment, for example, by using a droplet discharge method or the like. SOLUTION: The method has a process for disposing a fluid object on a substrate and a drying process for drying the liquid content of the fluid object at an evaporation rate limiting. The evaporation rate limiting satisfies the formula, wherein tevapis an evaporation time, tdiffis a diffusion time, k is Boltzmann constant, T is a temperature,σis a collision section area, Pevap(t) is a solvent partial pressure at a time (t) in an evaporation process, and Pdiff(t) is a solvent partial pressure at a time (t) in a diffusion process. COPYRIGHT: (C)2004,JPO&NCIPI