| 摘要 |
An apparatus is disclosed which improves the optical monitoring of semi-conductor wafers undergoing chemical mechanical planarization. The apparatus consists of two assemblies. Firstly, a fiber optical wave-guide assembly installed within the polishing pad during the pad's construction. This assembly forms an integrated optical waveguide originating from the center of rotation of the polishing pad and terminating at a location within the wafer track. Secondly, a vacuum hub, tube, and angular encoder assembly, which provides light coupling to the center of rotation of the polishing pad and also provides resolution of the angular position and speed of the polishing pad, polishing table, and optical waveguide.
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