PROCESS FOR PRODUCING CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To obtain a high quality circuit board by stabilizing connection resistance of a double-sided circuit board and a multilayer substrate when a low compressibility prepreg sheet is employed.

SOLUTION: After metal foils are placed on the opposite sides of a compressive prepreg sheet having a through hole filled with conductive paste, the prepreg sheet is pressed while raising the temperature sequentially to a first relatively low heating temperature, a second heating temperature and then to a third heating temperature, thus fusing and curing resin of the prepreg sheet. Consequently, the connection resistance is stabilized and a high quality circuit board is attained.

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