| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bond-dicing integrated film where the warping that occurs when a die bond film is pasted to a dicing film is reduced to eliminate weaving when winding thereafter. SOLUTION: The surface comprising an bonding agent layer (12) of a die bond film (1) in which the bonding agent layer (12) is provided on a support film (11), and the face comprising the adhesive layer (22) of a dicing film (2) in which the adhesive layer (22) is provided on a base material film (21) are laminated to face each other. The expression 0.5≤B<SB>1</SB>/A<SB>1</SB>≤2.0 is established where A<SB>1</SB>[GPa] is tensile elasticity of the support film (11) in lengthwise direction at 25°C, and B<SB>1</SB>[GPa] is that of the base material film (21) at 25°C in the lengthwise direction. COPYRIGHT: (C)2004,JPO&NCIPI |
