发明名称 EPOXY VINYL ESTER RESIN COMPOSITION AND ITS CURED MOLDING
摘要 PROBLEM TO BE SOLVED: To provide an epoxy vinyl ester resin composition which has excellent flame retardancy without using a bromine compound, and good storage stability, and can be suitably used as a binder resin in an electrical insulating material, an electrical laminate, FRP molding material, etc., and to provide a cured molding of the composition. SOLUTION: The epoxy vinyl ester resin composition comprises an epoxy vinyl ester resin (A) derived from a modified reaction product of an epoxy compound (a1) having at least two epoxy groups in a molecule with a single functional phenolic compound (a2), and an ethylenically unsaturated monocarboxylic acid (a3), and a phosphate (B). The cured molding is produced by using the composition. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004217912(A) 申请公布日期 2004.08.05
申请号 JP20030427393 申请日期 2003.12.24
申请人 DAINIPPON INK & CHEM INC 发明人 ITO HIRONOBU;KITAZAWA SEIICHI
分类号 C08L63/00;C08F290/00;C08K5/521;(IPC1-7):C08L63/00 主分类号 C08L63/00
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