| 摘要 |
PROBLEM TO BE SOLVED: To provide a film-forming method for preventing bumping during film formation, in the film-forming method by heating and vaporizing a metallic material and depositing the vaporized metal on a substrate to form the metal film, and to provide a film-forming apparatus. SOLUTION: The film-forming method comprises heating the metallic material to vaporize it and depositing the vaporized metal on the substrate to form the metal film, wherein the above metallic material, in the above step of depositing the metal on the above substrate, is heated in such a vacuum environment as to make the vapor pressure temperature lower than a melting point of the above metallic material under a normal pressure, at first, at a higher temperature than the above melting point of the metallic material for a predetermined time, and subsequently at a lowered temperature to the melting point to be melted and vaporized. COPYRIGHT: (C)2004,JPO&NCIPI
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