| 摘要 |
PROBLEM TO BE SOLVED: To prevent oxidation of a front surface of a heat sink as much as possible by surely preventing overrun during carrying the heat sink on a carrying path and reducing suction power to be irreducibly minimum for preventing occurrence of a flaw. SOLUTION: While sliding on a carrying path by the sending pawl 11 of an intermittently sending apparatus 4, the heat sink 3 is carried intermittently. In a solder application station, the vacuum of a vacuum regulator 14 is set to be a prescribed value and an application nozzle 21 moved in the direction of a plane is lowered onto the heat sink 3 in the state of being suctioned with "medium" suction power via a suction hole 12 to apply the solder 5. In the next mounting station, the vacuum of the vacuum regulator 14 is set to be a prescribed value, and a mounting nozzle 22 moved through the solder 5 in the direction of the plane is lowered onto the heat sink 3 in the state of being suctioned with "strong" suction power via a suction hole 12 to mount a die 6. COPYRIGHT: (C)2004,JPO&NCIPI
|
