HEAT RESISTANT ADHESIVE, METHOD FOR PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an adhesive comprised of a thermosetting resin composition, which is liquid at room temperature(25°C) and excellent in workability such as casting etc. because of its low viscosity and gives after curing a cured resin product excellent in heat resistance, especially in mechanical properties at a higher temperature, and a semiconductor device using it.

SOLUTION: The heat resistant adhesive comprises a thermosetting resin composition whose essential components are an epoxy resin(a), a reaction product(b) of water and an organic silicon compound shown by general formula (1) (wherein R is an organic group containing a functional group which makes addition reaction with the epoxy resin and R' is a methyl or ethyl group), a bismaleimide compound(c) shown by general formula (2) (wherein A is a divalent organic group having at least two carbon atoms) and a curing agent(d).

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