| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive composition with which an insulating film with low water absorption and high reliability is manufactured. <P>SOLUTION: [1] The positive photosensitive composition contains: a positive photoresist composition comprising a quinone diazide compound and a novolac resin; an epoxy compound having two or more epoxy groups in one molecule; and a compound which generates an acid or a base by heat or electromagnetic rays at wavelengths shorter than the photosensitive wavelength of the quinone diazide compound. [2] A semiconductor member is manufactured by applying the positive photosensitive composition described in [1] on a substrate, exposing, developing the exposed part and hardening the unexposed part by heat. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
