WET ETCHING APPARATUS FOR SEMICONDUCTOR WAFER

摘要

PURPOSE: A wet etching apparatus for semiconductor wafer is provided to improve etch uniformity and shorten an interval of etch time by decreasing an etch variation of each position on a semiconductor wafer by a half as compared with a conventional technique. CONSTITUTION: A wafer mounting jig on which a wafer is mounted is so installed to make the surface to be etched face downward. The wafer is mounted on the lower surface of a mounting plate(210). A supporting axis(211) extends in a vertical direction from the upper surface of the mounting plate. At least two supporting bars(213) support the supporting axis in a predetermined position so that the supporting axis can rotate, extending in parallel with the mounting plate. At least two holders(215) for fixing the wafer are formed on the lower surface of the supporting plate.