SILICONE RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A silicone resin composition for semiconductor package is provided, to suppress crystallization by introducing a bulky pendant group into a polysiloxane resin having a vinyl group at both ends, thereby reducing low temperature elastic modulus. CONSTITUTION: The silicone resin composition comprises 20-50 wt% of at least one represented by the formula 1 having a viscosity of 100-100,000 cps, as a polysiloxane resin having a vinyl group at both ends; a polyvinyl polysiloxane resin; a hydrosiloxane-based curing agent; a curing inhibitor; a silane-based adhesion imparting additive; a platinum catalyst; and a spherical silica, wherein R1 is a phenyl group or a linear or branched alkyl group of C4 or more; and R2 is identical to R1 or a linear or branched saturated alkyl group of C1-C3.