| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive semiconductor package for low melting point glass terminal hermetical multichip module, which has a high heat conduction function. SOLUTION: In the inexpensive multichip semiconductor package with a low melting point glass terminal hermetical multichip structure, a plurality of bare chips 5 and 6 different in heat dissipation are mounted on a carrier base 1 and are hermetically sealed. The package is provided with a high heat dissipation function region 3 where the bare chips 5 and 6 different in heat dissipation are mounted on the carrier base 1 and with a low heat dissipation function region (1). COPYRIGHT: (C)2004,JPO
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