发明名称 |
Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor |
摘要 |
The present invention provides plating solutions having either copper bis(perfluoroalkanesulfonyl) imides or copper tris(perfluoroalkanesulfonyl) methides and methods of electrochemically or chemically depositing copper interconnects using these plating solutions.
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申请公布号 |
US2004112756(A1) |
申请公布日期 |
2004.06.17 |
申请号 |
US20020320263 |
申请日期 |
2002.12.16 |
申请人 |
3M INNOVATIVE PROPERTIES CO |
发明人 |
BOYD STEVEN D;KESARI SUSRUT;LAMANNA WILLIAM M;PARENT MICHAEL J;ZAZZERA LAWRENCE A;ZHANG HAIYAN |
分类号 |
C23C16/00;C23C18/40;C25D3/38;(IPC1-7):C25D3/38 |
主分类号 |
C23C16/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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