| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the size of the upper surface of a PD coupled to an IC from being restricted by the size of the IC even when a package is miniaturized. <P>SOLUTION: In a signal communication structure 100 comprising a signal communication element 106, an integrated circuit chip 104 and a substrate 102, one face 118 of the signal communication element 106 is physically coupled to one face 110 of the integrated circuit chip 104, the other face 112 of the integrated circuit chip 104 is communicatively coupled to the substrate 102 and the size of the signal communication surface 116 of the signal communication element 106 is larger than the surface of the integrated circuit chip 104 to which the signal communication element 106 is physically coupled. <P>COPYRIGHT: (C)2004,JPO |
