发明名称 SILVER ALLOY SPUTTERING TARGET AND PROCESS FOR PRODUCING THE SAME
摘要 A silver alloy sputtering target is provided which is useful in forming a thin silver-alloy film of a uniform thickness by the sputtering method. When crystal orientation strengths are determined at four arbitrary positions by the X-ray diffraction method, the orientation which exhibits the highest crystal orientation strength (Xa) is the same at the four measurement positions, and variations in strength ratio (Xb/Xa) between the highest crystal orientation strength (Xa) and the second highest crystal orientation strength (Xb) is 20% ore less.
申请公布号 KR20040044481(A) 申请公布日期 2004.05.28
申请号 KR20047002714 申请日期 2003.06.23
申请人 发明人
分类号 C23C14/34;C22C5/06;C22C5/08 主分类号 C23C14/34
代理机构 代理人
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