VERFAHREN UND VORRICHTUNG ZUM BOHREN VON MIKROSACKLÖCHERN IN ELEKTRISCHEN SCHALTUNGSPACKUNGEN
摘要
<p>This invention relates to using mid-infrared high-power pulsed laser radiation sources for drilling high-quality microvia interconnection holes in printed circuit (wiring) boards and other electrical circuit packages.</p>
申请公布号
DE69911963(T2)
申请公布日期
2004.05.19
申请号
DE1999611963T
申请日期
1999.05.27
申请人
EXITECH LIMITED, LONG HANBOROUGH;EXCELLON AUTOMATION CO., TORRANCE
