| 摘要 |
An electronic power module including at least one semi-conductor power component disposed on an electrically insulating substrate, wherein said semi-conductor power component includes a face in contact with said substrate, which face is metallized in part and is covered in part in a diamond layer, said metallized portion being in contact with a conductor track provided on the surface of the substrate, and said diamond-covered portion being in register with an opening formed in the substrate, said substrate including a face remote from the semi-conductor component which is cooled by a liquid coolant, said liquid flowing into said opening and over the surface of the diamond-covered portion.
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