| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce chip searching operations in frequency and to improve a pick-up operation in efficiency. <P>SOLUTION: A semiconductor chip pick-up device is equipped with a first image sensing means (first camera 3) which images a pick-up target chip C and outputs an image I1 as image information and a first image processing means 4 which recognizes coordinates of a barycenter and an imperfect external appearance on the image I1. a second image sensing means (second camera 6) which images other chips C around the target chip C and outputs an image I2 as image information, a second image processing means 8 which determines whether the other chips C bear bad marks or not, recognizes the coordinates of a barycenter on the image I2, and forms map data of information concerning the other chips C as candidates for pick-up target chips when it is determined that the other chips C are not defective, and a control means 13 which moves a table 1 for correction on the basis of table correcting information obtained from the first image processing means 4 and moves the table 1 on the basis of the map data obtained from the second image processing means 8. <P>COPYRIGHT: (C)2004,JPO |
