| 摘要 |
An electroconductive silicone rubber sponge composition comprising: 100 parts by weight of a polyorganosiloxane, 1 to 100 parts by weight of all electroconductive filler such as carbon black, 0.01 to 50 parts by weight of a hollow thermoplastic resin powder, 0.1 to 10 parts by weight of a liquid compound that has a boiling point above room temperature, preferably water or an alcohol and a curing agent in an amount sufficient to cure the composition. An optional reinforcing filler may be added. The composition is capable of forming an electroconductive silicone rubber sponge having uniform and microfine foam cells. Methods for preparing the composition and the sponge are also disclosed
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