| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a thin semiconductor chip which can keep a thinned wafer in a stable shape in each step during processing when processing the wafer, and which can prevent cracking, chipping, warping, or other problems of the wafer. <P>SOLUTION: When processing one face (1a) of the thin wafer (1) to fabricate the thin semiconductor chip, the other face (1b) of the thin wafer is pasted to a rigid supporter (2) and a ring-shaped frame (3) which surrounds the periphery of the thin wafer (1) is pasted to the rigid supporter (2), and then the face (1a) is processed. <P>COPYRIGHT: (C)2004,JPO</p> |
