| 摘要 |
PURPOSE: To prevent the occurrence of short-circuit accidents caused by the contact of wires one another when the wires are obliquely bonded to the side of a chip in an LSI, wherein the chip having bonding pads arranged in a zigzag pattern is used. CONSTITUTION: Outer pads 2A1, 2A2,... on a chip 1 are arranged at an equal interval on one straight line along a side 6 of the chip. Inner pads 2B1, 2B2,... are arranged as follows, respectively. As an example, the inner pad 2B1 to be located between the neighboring outer pads 2A1 and 2A2 is set on the extending line of the line connecting the tip of an inner lead 3B1, which is connected to the pad 2B1, and the central point between the outer pads 2A1 and 2A2. |
