| 摘要 |
PROBLEM TO BE SOLVED: To improve a current resistance characteristic of a film capacitor of an exterior cladding-less surface packaging type and solder heat resistance property, and reduce the cost. SOLUTION: A first external electrode comprising first and second metalicon layers is provided on both end surfaces of a capacitor element where a pair of metallized films are overlapped and wound, and a later winding plastic film is overlapped and wound, and a plate-shaped second external electrode having an inverted U-shaped opening, C-shaped opening or 4 rectangular or drum-shaped opening is joined with the first external electrode. A ratio of an area of an opening of a plate shaped terminal of the second external electrode and an area of a metalicon surface side is 0.05 to 0.35. The first metalicon layer comprises any of an alloy consisting of Al of 40 to 56 % and Si of 4% or more and Zn of 40 % or more, an alloy consists of Zn of 90 % or more and remaining Al, an alloy consisting of Cu of 60 to 70 % and remaining Zn or single Zn, and a second metalicon layer consists of Sn of 80 % or more and remaining Zn and Cu. COPYRIGHT: (C)2004,JPO
|
