| 摘要 |
PROBLEM TO BE SOLVED: To improve accuracy in the detection of a box mark or an alignment mark while suppressing complexity in manufacturing steps. SOLUTION: In a box mark area or an alignment mark area, a range from a trench 2 to an active area is etched to form a dummy pattern 7 around the trench 2 and CMP is applied to an insulating film 3 to form a step 8 within the trench 2 where the insulating film 3 is to be buried. COPYRIGHT: (C)2004,JPO
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