Method of forming through-hole or recess in silicon substrate

摘要

A method of forming a through-hole (20) or a recess (20a) in a silicon substrate (10), having a conductor pattern (12) formed on one side thereof by irradiating a laser beam (18) onto the silicon substrate. First, a protective film (14) for protecting the conductor pattern (12) is formed on the one side of the silicon substrate (11). Next, a metal plating film (16) is adhered to the protective film (12), over substantially the entire surface of the silicon substrate (10) inclusive of the top of the protective film (14). Next a laser beam (18) is irradiated onto a predetermined position of the silicon substrate (10) covered with the protective film (14) and the metal plating film (16), to form a through-hole (20) or a recess (20a) in the silicon substrate (10). Then the metal plating film (16) is peeled off and debris (22), on the metal plating film (16) around the open periphery of the through-hole (20) or the recess (20a), which has been deposited thereon during the formation of the through-hole or the recess by the laser beam irradiation (18) is removed. Finally, a deposit (22a), on the inner wall of the thorough-hole (20) or the recess (20a), which has been deposited thereon during the formation of the thorough-hole or the recess by the laser beam irradiation (18) is removed, by use of a removing solution which does not damage the protective film (14).