| 摘要 |
PROBLEM TO BE SOLVED: To provide a package which can suppress foreign matters attaching to a semiconductor chip, and a semiconductor chip transporting technique. SOLUTION: A storage pocket 16 for putting the semiconductor chip 3 is provided on one of surfaces of a tray 15 serving as the package. The pocket 16 is formed to be rectangular, with four corners removed. A dented counterbore is formed on the bottom of the pocket 16. A protrusion 18 is in addition provided on the surface opposite to the surface formed with the pocket 16 of the tray 15 at a position opposite to the pocket 16. COPYRIGHT: (C)2004,JPO
|
