发明名称 Low dielectric loss signal line having a conductive trace supported by filaments
摘要 A circuit board or microelectronic device in which conductive signal lines are suspended or supported by filaments in air, rather than surrounded by a solid dielectric material. Dry air has a low relative permittivity and extremely low loss tangent compared with common dielectric substrates in which signal lines are currently embedded within circuit boards and microelectronic devices. The signal intensity attenuation for filament-suspended or filament-supported signal lines is much lower than signal lines embedded in solid dielectric materials, allowing for transmission of significantly higher frequency signals within filament-suspended and filament-supported signal lines.
申请公布号 US6696906(B1) 申请公布日期 2004.02.24
申请号 US20010870839 申请日期 2001.05.30
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 DEBLANC JAMES J.;DICKEY DAVID;CHERNISKI ANDREW MICHAEL
分类号 H01P3/08;H05K1/02;(IPC1-7):H01P3/08 主分类号 H01P3/08
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