Electrically isolated power device package

摘要

A packaged power device (24) includes a substrate (28) including a first conductive layer (30), a dielectric layer (32), and a second conductive layer (34). The first conductive layer (30) is bonded to the dielectric layer (32), and the dielectric layer (32) is bonded to the second conductive layer (34). The first and second conductive layers (30,34) are electrically isolated from each other. The substrate has a lower surface. A semiconductor die (26) is bonded to the first conductive layer (30) of the substrate (28). A plastic package (36) encloses the die (26) and has a lower surface. A curved backside includes the lower surfaces of the plastic package (36) and substrate (28).