| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-stress/low-temperature adhesive film which has low-moisture absorption properties, and is suitably applied to a copper lead frame. SOLUTION: The adhesive film is obtained as follows: Siloxane diamine H<SB>2</SB>N-(CH<SB>2</SB>)<SB>3</SB>-Si(CH<SB>3</SB>)<SB>2</SB>-[O-Si(CH<SB>3</SB>)<SB>2</SB>]<SB>10</SB>-(CH<SB>2</SB>)<SB>3</SB>-NH<SB>2</SB>of 0.05 mol, 2, 2-bis(4-(4-aminophenoxy)phenyl) propane of 0.05 mol, and decamethylene bistrimellitate dianhydride of 0.1 mol are made to react with each another, and then acetic anhydride and pyridine are added to them. The reaction solution is poured into water, and precipitated polymer is gathered by filtering. Thermosetting resin, a filler, and a solvent are added to the precipitated polymer, to form varnish. The varnish is applied on a base film, and the base film is heated. Lastly, the base film is peeled off at room temperature, and the adhesive film is obtained. COPYRIGHT: (C)2004,JPO
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