发明名称 Thermal head lapping apparatus
摘要 A thermal head lapping apparatus includes a pallet for holding at least one thermal head, a transport device for transporting the thermal head held on the pallet successively to a specified processing position, and a lapping device for forcing a lapping material being moved onto the thermal head that has been transported to said processing position. As a result, the apparatus is capable of advantageously performing lapping treatment with a good efficiency on surfaces to be coated with protective layers or the formed protective layers in a process of fabricating a thermal head, thereby improving the production efficiency of the thermal head and fabricating with a good productivity the suitably lapped thermal head of high quality that ensures high quality image recording.
申请公布号 US6688951(B2) 申请公布日期 2004.02.10
申请号 US20000534555 申请日期 2000.03.27
申请人 FUJI PHOTO FILM CO., LTD. 发明人 KASHIWAYA MAKOTO;NAKADA JUNJI
分类号 B24B19/26;B24B21/00;B24B27/00;B41J2/335;(IPC1-7):B24B7/00 主分类号 B24B19/26
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