| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board, mounted circuit board and mounting method for an electronic component capable of preventing the malfunction of solder bonding. SOLUTION: On a circuit board 1 with components mounted on a surface thereof such as electronic components 12, 13, 14, 15, electrode portions 2, 3, 4, 5 formed for solder-bonding terminals 12a, 13a, 14a, 15a are constituted of assemblies forming a solder precoat S5 on a micro pattern with an electric conductive pad 5a partially exposed by opening a pattern hole in a resist layer 1b on the electric conductive pad 5a. The size of these micro patterns is set to the area (0.018-2.3 mm<SP>2</SP>) of a specified range capable of obtaining the stable height of solder in solder precoating formation. Thereby the malfunction of the solder bonding can be prevented by eliminating the dispersion of the solder in height caused by the difference of electrode size. COPYRIGHT: (C)2004,JPO
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