| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board for manufacturing a multilayer wiring board which has a landless structure and can form a fine wiring pattern and to which a batch lamination system with high productivity is applicable, and to provide its manufacturing method and further a multilayer wiring board obtained by using the method. SOLUTION: By the manufacturing method including a process of forming a resist metal layer (I) and a conductor circuit by electrolytic plating while using the metal layer as a lead for electrolytic plating, a process of forming an insulating layer on the conductor circuit, a process of forming a via hole in the insulating layer so that part of the conductor circuit is exposed, a process of forming a resist metal layer (II) and a conductor post by electrolytic plating, and a process of etching the metal layer away, the conductor circuit at a part connected to the conductor post is formed as a structure having a part smaller than the size of the conductor post. COPYRIGHT: (C)2004,JPO |
