Method and apparatus for handling semiconductor wafers

摘要

The handling method uses an automatic handling tool with a gripper (1) moved parallel to a semiconductor disc (12), with pneumatic seizure of the latter and centring relative to the gripper via centring elements (4,11), before fixing the disc to a holder (3) within the gripper via a vacuum. The centring elements are released and the holder is rotated to bring the disc into a required angular position, detected via sensors (16,17). An Independent claim for a handling device for semiconductor dics is also included.