发明名称 MOISTURE-CURABLE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a moisture-curable composition which has a low viscosity and hence a good workability before curing, is soft after curing, can be filled into an outer wall joint with high following-up properties, and does not allow a plasticizer to migrate, thus preventing the staining of a sealed section and the degradation in adhesiveness. SOLUTION: This moisture-curable composition contains (A) an organic polymer of which the main chain substantially is a (meth)acrylate copolymer and which has at least one silicon-containing organic group having a hydroxyl or hydrolyzable group directly bonded to a silicon atom and capable of cross- linking by forming a siloxane bond and (B) an organic polymer of which the main chain substantially is a polyalkylene oxide and which has at least one silicon-containing organic group having a hydroxyl or hydrolyzable group directly bonded to a silicon atom and capable of cross-linking by forming a siloxane bond and has a number average mol.wt. of≤5,000. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003342465(A) 申请公布日期 2003.12.03
申请号 JP20020154200 申请日期 2002.05.28
申请人 SEKISUI CHEM CO LTD 发明人 IKEUCHI TAKUTO
分类号 C08L71/02;C08G81/02;(IPC1-7):C08L71/02 主分类号 C08L71/02
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