Package board for multiple-pin ball grid array package, multiple-pin ball grid array package, and semiconductor device

摘要

In a package board for a ball grid array package, bypassing wiring is provided for connecting external electrodes (pins) with each other. A ball grid array package is obtained by mounting an electric element on such a package board. Further, such ball grid array package is mounted on a common mounting board together with other electric element or elements. The other electric elements on the mounting board may be connected through the internal wiring in the package board. The wiring density of the mounting board for mounting a multiple-pin ball grid array package (BGA) or other electric elements can be reduced without increasing the number of layers in the entire body of the mounting board.