| 发明名称 |
HALBLEITERANORDNUNG |
| 摘要 |
The present invention alleviates the operational problems in production of flip chips and provides a semiconductor device superior in various reliabilities. The preset invention lies in an encapsulated semiconductor device comprising: a polybenzoxazole resin film for chip protection, obtained by coating, on a circuit-formed chip, a positive photosensitive resin composition comprising 100 parts by weight of a polyamide and 1 to 100 parts by weight of a photosensitive diazoquinone compound, and subjecting the coated composition to patterning and curing, and (b) a bump electrode. <IMAGE> |
| 申请公布号 |
DE60005959(D1) |
申请公布日期 |
2003.11.20 |
| 申请号 |
DE2000605959 |
申请日期 |
2000.02.23 |
| 申请人 |
SUMITOMO BAKELITE CO., LTD. |
发明人 |
HIRANO, TAKASHI;YAMAMOTO, KAGEHISA;BANBA, TOSHIO;MAKABE, HIROAKI |
| 分类号 |
B05D7/00;C08G73/22;C09D179/04;G03F7/004;G03F7/022;G03F7/023;G03F7/037;G03F7/039;H01L21/027;H01L21/312;H01L21/60;H01L23/29;H01L23/31;H01L23/485;H01L23/532 |
主分类号 |
B05D7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
