发明名称 |
PRODUCTION OF VIA HOLE IN FLEXIBLE CIRCUIT PRINTABLE BOARD |
摘要 |
A flexible circuit printable board can be favorably produced by a process composed of steps of forming in a polyimide film having a metal coat on each surface side a via hole penetrating at least one metal coat and the polyimide film; and applying a mixture of liquid and abrasive grains under pressure onto the via hole, whereby smoothing an edge of the via hole and cleaning the via hole. |
申请公布号 |
AU2003222457(A1) |
申请公布日期 |
2003.11.10 |
申请号 |
AU20030222457 |
申请日期 |
2003.04.24 |
申请人 |
UBE INDUSTRIES, LTD. |
发明人 |
OSAMU NAKAYAMA;RYUICHIRO KOGURE;TADAHIRO YOKOZAWA;HIROAKI YAMAGUCHI |
分类号 |
C25D5/34;C25D7/00;H05K1/00;H05K3/00;H05K3/06;H05K3/26;H05K3/28;H05K3/42;(IPC1-7):H05K3/00 |
主分类号 |
C25D5/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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