发明名称 |
Sheet resin composition and process for manufacturing semiconductor device therewith |
摘要 |
A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a substrate during subsequent fabrication of a semiconductor device, the chip being flip chip mounted to the substrate.
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申请公布号 |
US2003207117(A1) |
申请公布日期 |
2003.11.06 |
申请号 |
US20030427610 |
申请日期 |
2003.04.30 |
申请人 |
UEDA HIROTAKA;MIZUTANI MASAKI |
发明人 |
UEDA HIROTAKA;MIZUTANI MASAKI |
分类号 |
C09J7/00;C09J163/00;H01L21/301;H01L21/304;H01L21/56;H01L21/68;H01L23/29;H01L23/31;(IPC1-7):B32B27/38 |
主分类号 |
C09J7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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