Cantilevered ball connection for integrated circuit chip package

摘要

An electronic device includes an integrated circuit chip (10), an interposer (30) and a printed circuit board (50). A first ball connector (40) is used to connect the interposer (30) to printed circuit board (50). The interposer (30) may be connected to the integrated circuit chip (10) by a second ball connector 20 or a wire bond. The first ball connector (40) is disposed on a cantilever structure formed in the interposer (30). The cantilever is formed by creating a channel in the interposer (30). The cantilever absorbs stress caused by a difference between the thermal expansion of the integrated circuit chip (10) as compared to the printed circuit board (50). The cantilever thus reduces stress in the ball connector by allowing the ball connector to move within a plane defined by the interposer.